TDK C2012X7R1E105K

包装/外壳

0805

终端数量

2

ECCN (US)

EAR99

HTS

8532.23.00.20

Capacitance Value

1uF

Equivalent Series Resistance Type

Low

Microwave Application

有

Special Features

低ESL

Mounting

表面贴装

Case Style

陶瓷芯片

Dissipation Factor (%)

5

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

125

Product Depth (mm)

1.25

Length Tolerance (mm)

±0.2

Depth Tolerance (mm)

±0.2

Height Tolerance (mm)

±0.2

Package Description

CHIP

Rohs Code

有

Manufacturer Part Number

C2012X7R1E105K

Manufacturer

TDK Corporation of America

Part Life Cycle Code

不推荐

Ihs Manufacturer

TDK CORP

Risk Rank

5.68

包装

卷带

容差

10%

无铅代码

有

零件状态

活跃

结构

Flat

Reach合规守则

compliant

终端样式

Pad

电介质

X7R

电压

25VDC

尺寸(mm)

2 X 1.25 X 1.25

产品长度(mm)

2

产品高度(mm)

1.25

RoHS状态

符合RoHS标准