TDK FT232RQ

表面安装

YES

终端数量

32

Package Description

HVQCCN, LCC32,.2SQ,20

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Moisture Sensitivity Levels

3

Package Body Material

UNSPECIFIED

Package Equivalence Code

LCC32,.2SQ,20

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

40

Supply Voltage-Min

3.3 V

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

FT232RQ

Package Code

HVQCCN

Package Shape

SQUARE

Manufacturer

FTDI Chip

Part Life Cycle Code

活跃

Ihs Manufacturer

FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD

Supply Voltage-Max

5.25 V

Risk Rank

1.48

ECCN 代码

EAR99

HTS代码

8542.39.00.01

技术

CMOS

端子位置

QUAD

终端形式

无铅

峰值回流焊温度（摄氏度）

260

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

S-XQCC-N32

资历状况

不合格

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

BUS CONTROLLER, UNIVERSAL SERIAL BUS

座位高度-最大

0.85 mm

总线兼容性

UART

驱动接口标准

RS232; RS422; RS485

宽度

5 mm

长度

5 mm