TE Connectivity 10610/BFBJC

表面安装

YES

终端数量

16

Manufacturer Part Number

10610/BFBJC

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Package Description

DFP, FL16,.3

Risk Rank

5.92

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC

Package Code

DFP

Package Equivalence Code

FL16,.3

Package Shape

RECTANGULAR

Package Style

FLATPACK

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

FLAT

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

R-XDFP-F16

资历状况

不合格

电源

-5.2 V

温度等级

MILITARY

逻辑IC类型

OR GATE

筛选水平

38535Q/M;38534H;883B

施密特触发器

NO