TE Connectivity 1654/BEA

表面安装

NO

终端数量

16

Manufacturer Part Number

1654/BEA

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Package Description

DIP, DIP16,.3

Risk Rank

5.91

Operating Temperature-Max

85 °C

Operating Temperature-Min

-30 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP16,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

资历状况

不合格

温度等级

OTHER

逻辑IC类型

BINARY COUNTER

筛选水平

MIL-STD-883 Class B (Modified)

电源电流-最大值(ICC)

55 mA

计数方向

UP

负载/预设输入

YES

操作方式

ASYNCHRONOUS