TE Connectivity 5-102618-1

触点镀层

Gold Over Nickel

房屋材料

Thermoplastic

Supplier Package

CFPAK

Maximum Propagation Delay Time @ Maximum CL

5.1@5V ns

Number of Output Enables per Chip

4 Low

Mounting

表面贴装

Body Orientation

Straight

Termination Method

Solder

Base/Housing Material

Thermoplastic

Contact Materials

磷青铜

Number of Contact Rows

2

Product Depth (mm)

10.16(mm)

Operating Temp Range

-65C to 105C

Mounting Styles

通孔

Pitch (mm)

2.54(mm)

Pitch Spacing

2.54mm

Maximum Operating Temperature

+ 105 C

Unit Weight

0.035274 oz

Minimum Operating Temperature

- 55 C

Factory Pack QuantityFactory Pack Quantity

464

Manufacturer

TE Connectivity

Brand

TE Connectivity

Latching Type

Detent Windows

Tradename

AMPMODU

RoHS

Details

Usage Level

Military grade

操作温度

-55 to 125 °C

包装

Tray

系列

AMPMODU MOD II

类型

带罩封头

定位的数量

6 Position

应用

Board-to-Board

行数

2 Row

性别

HDR

子类别

Headers & Wire Housings

螺距

1.2700

引脚数量

48

终端样式

焊针

接头数量

6(POS)

触点性别

Pin (Male)

房屋颜色

Black

极性

Non-Inverting

行间距

2.54 mm

逻辑功能

Buffer/Line Driver

配套立柱长度

8.08 mm

产品类别

Headers & Wire Housings

筛选水平

Military

端子柱长度

3.18 mm

最大额定电流

3/Contact(A)

产品

Headers

安装角

Straight

产品类别

Headers & Wire Housings

产品长度

16.3

产品宽度

9.65 mm

产品长度(mm)

10.46(mm)

产品高度(mm)

11.17(mm)

可燃性等级

UL 94 V-0