TE Connectivity 8X305/BUC

表面安装

YES

终端数量

68

Package Description

QCCN, LCC68,.95SQ

Package Style

CHIP CARRIER

Package Body Material

CERAMIC

Package Equivalence Code

LCC68,.95SQ

Operating Temperature-Min

-55 °C

Supply Voltage-Nom

5 V

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

8X305/BUC

Package Code

QCCN

Package Shape

SQUARE

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

5.59

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Microprocessors

技术

TTL

端子位置

QUAD

终端形式

无铅

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

S-XQCC-N68

资历状况

不合格

电源

5 V

温度等级

MILITARY

uPs/uCs/外围ICs类型

MICROPROCESSOR, RISC

位元大小

8

筛选水平

38535Q/M;38534H;883B