TE Connectivity CB5027-000

包装/外壳

QFN-72

材料

Polyolefin (PO), Irradiated

本体材质

Polymer

Moisture Sensitive

有

Distributed RAM

80 kbit

Number of Logic Elements

17000 LE

Number of I/Os

192 I/O

Embedded Block RAM - EBR

432 kbit

Maximum Operating Temperature

+ 85 C

Supply Voltage-Max

1 V

Minimum Operating Temperature

0 C

Factory Pack QuantityFactory Pack Quantity

168

Supply Voltage-Min

1 V

Manufacturer

Lattice

Brand

Lattice

Tradename

CrossLink-NX

RoHS

Details

Product Thickness

3.05

Operating Temp Range

-55C TO 90C

Shrink Wall Type

THICK

Inside Diameter After Shrinking

9.52

Inside Diameter Before Shrinking

27.94

Lead Free Status / RoHS Status

--

Inner Diameter - Supplied

1.100 (27.94mm)

Inner Diameter - Recovered

0.375 (9.53mm)

Package

Bulk

Base Product Number

CB50

厂商

TE Connectivity Raychem 电缆保护

Product Status

活跃

系列

LIFCL-17

操作温度

-55°C ~ 110°C

零件状态

活跃

湿度敏感性等级(MSL)

--

类型

TUBING

颜色

Clear

子类别

可编程逻辑集成电路

工作电源电压

1 V

保质期

144 Months

储存/恢复温度

32°F ~ 95°F (0°C ~ 35°C)

产品类别

FPGA - Field Programmable Gate Array

保质期开始

-

收缩率

3 to 1

收缩温度

90°C

特征

Abrasion Resistant, Fluid Resistant

产品类别

FPGA - Field Programmable Gate Array

收缩率

3:1

产品长度(mm)

1219.2(mm)

长度

4.00 (1.22m)

回收壁厚

0.120 (3.05mm)