TE Connectivity DTS20Z11-05SCC021

触点镀层

Gold

外壳材料

Aluminum

Package

Box

Base Product Number

XCZU67

厂商

AMD

Product Status

活跃

For Use With/Related Products

XCZU67DR

Shell Sizes

11

Shell Style#

方形法兰

MIL Type

MIL-DTL-38999 III

Voltage, Rating

600 VAC, 850 VDC

Factory Pack QuantityFactory Pack Quantity

1

Mounting Styles

Panel

Insert Arrangement

11-05

Contact Materials

Copper Alloy

Mating Style

Threaded

Part # Aliases

YDTS20Z11-05SCC021

Manufacturer

TE Connectivity

Brand

TE Connectivity / DEUTSCH

RoHS

Details

系列

Zynq® UltraScale+™

类型

FPGA + MCU/MPU SoC

定位的数量

5 Position

子类别

Circular Connectors

额定电流

7.5 A

终端样式

Crimp

触点性别

Socket (Female)

注意

P/N Breakdown: J = Japan version does not ship with a power supply

产品类别

军规圆形连接器

内容

Board(s), Cable(s), Accessories - Power Supply Not Included -

平台

Zynq UltraScale+ RFSoC ZCU670 V2 Japan

外壳电镀

锌 镍

产品

Receptacles

安装角

Straight

互连系统

FMC+

建议的编程环境

Vivado

产品类别

军规圆形连接器