TE Connectivity DTS24H23-01DA[V001]

包装/外壳

1812

终端数量

2

Product Depth (mm)

3.17(mm)

Wire Form

不需要

Operating Temp Range

-55C to 125C

Case Style

陶瓷芯片

Product Diameter (mm)

Not Required(mm)

Mounting Styles

表面贴装

Temp Coeff (Dielectric)

X7R

Lead Diameter (nom)

Not Required(mm)

Tolerance (+ or -)

20%

Rad Hardened

无

Microwave Application

NO

Seated Plane Height

Not Required(mm)

包装

卷带

电容量

3300(pF)

技术

STANDARD

结构

SMT 芯片

终端样式

PAD

失败率

不需要

电压

1000VDC

产品长度(mm)

4.57(mm)

产品高度(mm)

2.8(mm)