TE Connectivity DTS26F13-35BA[V001]

包装/外壳

0201

终端数量

2

Seated Plane Height

Not Required(mm)

Microwave Application

NO

Rad Hardened

无

Tolerance (+ or -)

10%

Lead Diameter (nom)

Not Required(mm)

Temp Coeff (Dielectric)

X5R

Mounting Styles

表面贴装

Product Diameter (mm)

Not Required(mm)

Case Style

陶瓷芯片

Operating Temp Range

-55C to 85C

Wire Form

不需要

Product Depth (mm)

0.3(mm)

包装

卷带

电容量

47000PF(pF)

技术

STANDARD

结构

SMT 芯片

终端样式

PAD

失败率

不需要

电压

6.3VDC

产品长度(mm)

0.6(mm)

产品高度(mm)

0.3(mm)