TE Connectivity H8F5SDRJCMJR-46M

表面安装

YES

终端数量

199

Manufacturer Part Number

H8F5SDRJCMJR-46M

Part Life Cycle Code

活跃

Ihs Manufacturer

SK HYNIX INC

Package Description

FBGA-199

Risk Rank

5.69

Number of Words

17179869184 words

Number of Words Code

16000000000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-30 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Supply Voltage-Nom (Vsup)

3.3 V

附加功能

SEATED HT-CALCULATED AND NAND FLASH IS ORGANISED AS 256MX8 AND SDRAM IS ORGANISED AS 32MX32

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.65 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B199

电源电压-最大值(Vsup)

3.6 V

温度等级

OTHER

电源电压-最小值(Vsup)

2.7 V

操作模式

SYNCHRONOUS

组织结构

16GX2

座位高度-最大

1.4 mm

内存宽度

2

记忆密度

34359738368 bit

内存IC类型

存储器电路

长度

18 mm

宽度

12 mm