TE Connectivity MS27466T19B11PB-LC
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MS27466T19B11PB-LC
2460-MS27466T19B11PB-LC
圆形连接器 - 外壳
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Circular MIL Spec Connector DJT 11C 11#16 PIN R ECP
1最小包装量--
MS27466T19B11PB-LC详情
TE Connectivity MS27466T19B11PB-LC重要参数规格及、参数值,及相似型号如下:
- 参数名参数值全选
- 参数名参数值全选
触点镀层
Gold
安装类型
电缆和面板
外壳材料
ALUMINUM ALLOY
房屋材料
Diallyl Phthalate (DAP)
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 55 C
Factory Pack QuantityFactory Pack Quantity
1
Mounting Styles
Cable
Contact Materials
Copper
Manufacturer
C&K Aerospace
Brand
C&K Aerospace
Shell Sizes
19
Contact Finish Mating
镍镀金
Rohs Code
无
Manufacturer Part Number
MS27466T19B11PB-LC
Part Life Cycle Code
活跃
Ihs Manufacturer
ESTERLINE TECHNOLOGIES CORP
Risk Rank
5.54
JESD-609代码
e4
ECCN 代码
EAR99
连接器类型
密耳系列连接器
定位的数量
60 Position
附加功能
STANDARD: MIL-C-38999
HTS代码
8536.69.40.20
子类别
Board to Board & Mezzanine Connectors
MIL一致性
YES
符合 DIN 标准
NO
IEC一致性
NO
过滤功能
NO
混合接触
NO
选项
GENERAL PURPOSE
触头总数
11
Reach合规守则
not_compliant
外壳完成
OLIVE GREEN CADMIUM
终端样式
Crimp
配套信息
MULTIPLE MATING PARTS AVAILABLE
触点性别
MALE
空壳
YES
后壳类型
SOLID
绝缘电阻
5000 MOhms
主体/外壳样式
RECEPTACLE
环境特征
FLUID RESISTANT
终端类型
CRIMP
耦合类型
BAYONET
触点表面处理 终端
Gold (Au) - with Nickel (Ni) barrier
产品类别
Board to Board & Mezzanine Connectors
产品
Connectors
产品类别
Board to Board & Mezzanine Connectors
可燃性等级
UL 94 V-0
MS27466T19B11PB-LC拓展信息
TE Connectivity
TE Connectivity Aerospace, Defense and Marine
TE Connectivity
TE Connectivity
TE Connectivity Aerospace, Defense and Marine
TE Connectivity Aerospace, Defense and Marine
TE Connectivity
TE Connectivity Aerospace, Defense and Marine
TE Connectivity
TE Connectivity







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