TEMIC HM1E65664A-MB

表面安装

NO

终端数量

28

Supply Voltage-Nom (Vsup)

5 V

Package Style

IN-LINE

Package Shape

RECTANGULAR

Package Code

DIP

Package Body Material

CERAMIC, GLASS-SEALED

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Number of Words Code

8000

Number of Words

8192 words

Access Time-Max

45 ns

Risk Rank

5.66

Package Description

CERAMIC, DIP-28

Ihs Manufacturer

TEMIC SEMICONDUCTORS

Part Life Cycle Code

Obsolete

Manufacturer Part Number

HM1E65664A-MB

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

Reach合规守则

unknown

JESD-30代码

R-GDIP-T28

资历状况

不合格

电源电压-最大值(Vsup)

5.5 V

温度等级

MILITARY

电源电压-最小值(Vsup)

4.5 V

操作模式

ASYNCHRONOUS

组织结构

8KX8

内存宽度

8

记忆密度

65536 bit

并行/串行

PARALLEL

内存IC类型

标准SRAM