Texas Instruments 74AC11011N

表面安装

NO

终端数量

16

Package Description

DIP, DIP16,.3

Package Style

IN-LINE

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP16,.3

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

74AC11011N

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

5.85

Prop.

9.1 ns

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Gates

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T16

资历状况

不合格

电源

3.3/5 V

温度等级

INDUSTRIAL

逻辑IC类型

AND GATE

最大 I(ol)

0.024 A

施密特触发器

NO