Texas Instruments DS55464J8/883B

表面安装

NO

终端数量

8

Package Description

DIP, DIP8,.3

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP8,.3

Operating Temperature-Min

-55 °C

Supply Voltage-Nom

5 V

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

DS55464J8/883B

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Texas

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Risk Rank

5.92

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

外围设备驱动

技术

BIPOLAR

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T8

资历状况

不合格

电源

5 V

温度等级

MILITARY

驱动程序位数

2

筛选水平

38535Q/M;38534H;883B