Texas Instruments LM3S8962-IBZ50

表面安装

YES

终端数量

108

Operating Temperature-Max

85 °C

Risk Rank

5.8

Ihs Manufacturer

Texas INC

Part Life Cycle Code

Obsolete

Rohs Code

有

Manufacturer Part Number

LM3S8962-IBZ50

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA108,12X12,32

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

RAM(byte)

65536

ROM(word)

262144

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B108

资历状况

不合格

电源

2.5,3.3 V

温度等级

INDUSTRIAL

速度

50 MHz

位元大小

32

只读存储器可编程性

FLASH