Texas Instruments LMH2121TMX

表面安装

YES

终端数量

4

Package Description

MICRO SMD-4

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

2.7 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

LMH2121TMX

Package Code

VFBGA

Package Shape

RECTANGULAR

Manufacturer

Texas

Part Life Cycle Code

Obsolete

Ihs Manufacturer

Texas INC

Risk Rank

5.16

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.4 mm

JESD-30代码

R-PBGA-B4

温度等级

INDUSTRIAL

座位高度-最大

0.675 mm

通信IC类型

射频和基带电路

宽度

0.866 mm

长度

1.07 mm

达到SVHC

unknown