Texas Instruments LMV228UR

表面安装

YES

终端数量

4

Package Description

1 X 1 MM, 0.35 MM HEIGHT, LEAD FREE, MICRO SMD-4

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Moisture Sensitivity Levels

1

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

2.7 V

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

LMV228UR

Package Code

VFBGA

Package Shape

SQUARE

Manufacturer

National Semiconductor Corporation

Part Life Cycle Code

Transferred

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Risk Rank

5.28

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn63Pb37)

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.5 mm

Reach合规守则

not_compliant

JESD-30代码

S-PBGA-B4

资历状况

不合格

温度等级

INDUSTRIAL

座位高度-最大

0.425 mm

通信IC类型

射频和基带电路

宽度

0.975 mm

长度

0.975 mm