Texas Instruments M38510/05554BEA

表面安装

NO

终端数量

16

Package Description

DIP,

Package Style

IN-LINE

Package Body Material

CERAMIC, GLASS-SEALED

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Manufacturer Part Number

M38510/05554BEA

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

QP Semiconductor

Part Life Cycle Code

Transferred

Ihs Manufacturer

QP SEMICONDUCTOR INC

Risk Rank

5.32

Part Package Code

DIP

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

锡铅

HTS代码

8542.39.00.01

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

6

Reach合规守则

unknown

引脚数量

16

JESD-30代码

R-GDIP-T16

资历状况

不合格

电源电压-最大值(Vsup)

15 V

温度等级

MILITARY

电源电压-最小值(Vsup)

4.5 V

家人

4000/14000/40000

输入数量

1

逻辑IC类型

BUFFER

筛选水平

MIL-PRF-38535 Class B

传播延迟(tpd)

345 ns