Texas Instruments MM54HC174J-MIL

表面安装

NO

终端数量

16

Usage Level

Military grade

Rohs Code

无

Risk Rank

8.79

Part Life Cycle Code

Obsolete

Package Style

IN-LINE

Package Shape

RECTANGULAR

Package Equivalence Code

DIP16,.3

Package Code

DIP

Package Body Material

CERAMIC

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Manufacturer Part Number

MM54HC174J-MIL

Manufacturer

National Semiconductor Corporation

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

FF/Latches

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

6

端子间距

2.54 mm

Reach合规守则

compliant

JESD-30代码

R-XDIP-T16

资历状况

不合格

电源

2/6 V

温度等级

MILITARY

逻辑IC类型

D FLIP-FLOP

筛选水平

MIL-STD-883 Class B (Modified)

触发器类型

积极优势