Texas Instruments MM74HC175N

表面安装

NO

材料

Polyolefin

终端数量

16

Rohs Code

无

Part Life Cycle Code

Transferred

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Package Description

DIP, DIP16,.3

Load Capacitance (CL)

50 pF

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

DIP

Package Equivalence Code

DIP16,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom (Vsup)

4.5 V

Wall thickness before shrinking

1 mm

Working temperature range

-55...+105 °C

Transport packaging size/quantity

43*18*30/100

Gross weight

162.00

Capacitors series

KGM

Case - mm

3225

Case - inch

1210

Mounting

SMD

Kind of capacitor

MLCC

Type of capacitor

ceramic

Operating temperature

-55...125°C

容差

±10%

JESD-609代码

e0

类型

Heat shrink tape with adhesive layer

端子表面处理

Tin/Lead (Sn/Pb)

颜色

Black

HTS代码

8542.39.00.01

电容量

1nF

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T16

资历状况

不合格

电介质

X7R

电源电压-最大值(Vsup)

6 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2 V

比特数

4

家人

HC/UH

座位高度-最大

5.08 mm

输出极性

COMPLEMENTARY

逻辑IC类型

D FLIP-FLOP

最大 I(ol)

0.004 A

触发器类型

积极优势

传播延迟(tpd)

190 ns

Shrink temperature

100 °C

Tensile strength

10 MPa

fmax-Min

28 MHz

最大频率@Nom-Sup

24000000 Hz

Operating voltage

≤10000 V

长度

5000 mm

宽度

25 mm