Texas Instruments MSP430F6638IZQW

表面安装

YES

终端数量

113

Manufacturer Part Number

MSP430F6638IZQW

Part Life Cycle Code

Obsolete

Ihs Manufacturer

Texas INC

Part Package Code

BGA

Package Description

PLASTIC, BGA-113

Risk Rank

5.44

Clock Frequency-Max

20 MHz

Number of I/O Lines

74

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Supply Voltage-Max

3.6 V

Supply Voltage-Nom

3 V

Supply Voltage-Min

2.4 V

附加功能

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

0.5 mm

Reach合规守则

unknown

引脚数量

113

JESD-30代码

S-PBGA-B113

资历状况

不合格

温度等级

INDUSTRIAL

速度

20 MHz

uPs/uCs/外围ICs类型

MICROCONTROLLER, RISC

位元大小

16

有ADC

YES

DMA 通道

YES

脉宽调制通道

YES

数模转换器通道

YES

座位高度-最大

1 mm

只读存储器可编程性

FLASH

长度

7 mm

宽度

7 mm