Texas Instruments OMAP3515BCUS

表面安装

YES

终端数量

423

Part Life Cycle Code

Obsolete

Ihs Manufacturer

TEXAS INSTRUMENTS INC

Package Description

FBGA, BGA423,24X24,25

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA423,24X24,25

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B423

资历状况

不合格

uPs/uCs/外围ICs类型

SoC