Texas Instruments TCI6638K2KBXAAW2

表面安装

YES

Contact plating

gold-plated

Number of pins

22

终端数量

1517

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

TEXAS INSTRUMENTS INC

Part Package Code

BGA

Package Description

BGA,

Operating Temperature-Max

85 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Shape

SQUARE

Package Style

网格排列

Supply Voltage-Max

1.05 V

Supply Voltage-Min

0.95 V

Supply Voltage-Nom

1 V

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

1x22

Gross weight

2.09 g

Operating temperature

-40...163°C

JESD-609代码

e1

ECCN 代码

5A002.A.1

端子表面处理

锡银铜

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

245

端子间距

1 mm

Reach合规守则

compliant

Current rating

1.5A

时间@峰值回流温度-最大值(s)

30

引脚数量

1517

JESD-30代码

S-PBGA-B1517

温度等级

OTHER

uPs/uCs/外围ICs类型

SoC

座位高度-最大

3.75 mm

Rated voltage

60V

总线兼容性

I2C; PCI; SPI; UART; USB

个人资料

beryllium copper

饱和电流

4

长度

40 mm

宽度

40 mm

Plating thickness

0.75µm

Flammability rating

UL94V-0