Texas Instruments TDA2HVBRQABCRQ1

表面安装

YES

Contact plating

gold-plated

Number of pins

6

终端数量

760

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

TEXAS INSTRUMENTS INC

Package Description

FBGA,

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

Supply Voltage-Max

1.2 V

Supply Voltage-Min

1.11 V

Supply Voltage-Nom

1.15 V

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

2x3

Row pitch

2.54mm

Gross weight

0.36 g

Operating temperature

-40...163°C

JESD-609代码

e1

无铅代码

有

ECCN 代码

5A992.C

端子表面处理

锡银铜

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

250

端子间距

0.8 mm

Reach合规守则

compliant

Current rating

1.5A

时间@峰值回流温度-最大值(s)

30

JESD-30代码

S-PBGA-B760

温度等级

AUTOMOTIVE

uPs/uCs/外围ICs类型

SoC

座位高度-最大

2.96 mm

筛选水平

AEC-Q100

Rated voltage

60V

个人资料

beryllium copper

饱和电流

3

长度

23 mm

宽度

23 mm

Plating thickness

0.75µm

Flammability rating

UL94V-0