Texas Instruments TMS320C6416EGLZ5E0

表面安装

YES

Contact plating

gold-plated

Number of pins

24

终端数量

532

Part Life Cycle Code

Obsolete

Ihs Manufacturer

TEXAS INSTRUMENTS INC

Part Package Code

BGA

Package Description

HFBGA,

Clock Frequency-Max

75.75 MHz

Package Body Material

PLASTIC/EPOXY

Package Code

HFBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Supply Voltage-Max

1.26 V

Supply Voltage-Min

1.14 V

Supply Voltage-Nom

1.2 V

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

SMT

Connector pinout layout

2x12

Row pitch

2.54mm

Gross weight

1.14 g

Operating temperature

-40...163°C

ECCN 代码

3A991.A.2

附加功能

ALSO REQUIRES 3.3V SUPPLY

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

unknown

Current rating

1.5A

引脚数量

532

JESD-30代码

S-PBGA-B532

资历状况

不合格

uPs/uCs/外围ICs类型

DIGITAL SIGNAL PROCESSOR, OTHER

座位高度-最大

3.3 mm

地址总线宽度

23

边界扫描

YES

低功率模式

YES

外部数据总线宽度

64

格式

固定点

Rated voltage

60V

桶式移位器

NO

内部总线架构

MULTIPLE

个人资料

beryllium copper

长度

23 mm

宽度

23 mm

Plating thickness

0.254µm

Flammability rating

UL94V-0