Texas Instruments X66AK2G12ABY60

表面安装

YES

终端数量

625

Package Description

LFBGA, BGA625,25X25,32

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA625,25X25,32

Supply Voltage-Nom

0.9 V

Supply Voltage-Min

0.855 V

Operating Temperature-Max

70 °C

Manufacturer Part Number

X66AK2G12ABY60

Package Code

LFBGA

Package Shape

SQUARE

Manufacturer

Texas

Part Life Cycle Code

Obsolete

Number of I/O Lines

212

Ihs Manufacturer

Texas INC

Supply Voltage-Max

0.945 V

Risk Rank

5.73

ECCN 代码

5A992C

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B625

Brand Name

Texas

温度等级

COMMERCIAL

uPs/uCs/外围ICs类型

多功能外围设备

座位高度-最大

1.56 mm

地址总线宽度

16

边界扫描

YES

外部数据总线宽度

32

内存(字)

1M

总线兼容性

CAN; ETHERNET; I2C; PCI; SPI; UART; USB

宽度

21 mm

长度

21 mm