Texas Instruments XCC1312R1F3RGZR

表面安装

YES

终端数量

48

Package Description

HVQCCN,

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3 V

Reflow Temperature-Max (s)

未说明

Supply Voltage-Min

1.8 V

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

XCC1312R1F3RGZR

Package Code

HVQCCN

Package Shape

SQUARE

Manufacturer

Texas

Part Life Cycle Code

Obsolete

Ihs Manufacturer

Texas INC

Supply Voltage-Max

3.8 V

Risk Rank

5.64

JESD-609代码

e4

ECCN 代码

5A992C

端子表面处理

Nickel/Palladium/Gold (Ni/Pd/Au)

附加功能

DIMENSION CONSIDER BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF

技术

CMOS

端子位置

QUAD

终端形式

无铅

峰值回流焊温度（摄氏度）

260

端子间距

0.5 mm

JESD-30代码

S-PQCC-N48

Brand Name

Texas

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

微处理器电路

座位高度-最大

1 mm

宽度

7 mm

长度

7 mm

达到SVHC

compliant