Torex Semiconductor XC6122C233MR-G

表面安装

YES

终端数量

5

Package Description

TSOP, TSOP5/6,.11,37

Package Style

SMALL OUTLINE, THIN PROFILE

Moisture Sensitivity Levels

1

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSOP5/6,.11,37

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

XC6122C233MR-G

Package Code

TSOP

Package Shape

RECTANGULAR

Manufacturer

Torex Semiconductor LTD

Part Life Cycle Code

活跃

Ihs Manufacturer

TOREX SEMICONDUCTOR LTD

Risk Rank

5.15

JESD-609代码

e3

端子表面处理

Tin (Sn)

子类别

电源管理电路

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

0.95 mm

Reach合规守则

compliant

JESD-30代码

R-PDSO-G5

资历状况

不合格

电源

1/6 V

温度等级

INDUSTRIAL

供应电流-最大值(Isup)

0.018 mA