Toshiba America Electronic Components SSM3K16CT

Contact plating

gold-plated

表面安装

YES

Number of pins

9

终端数量

3

晶体管元件材料

SILICON

外壳材料

1

Drain Current-Max (ID)

0.1 A

Operating Temperature-Max

150 °C

Package Body Material

UNSPECIFIED

Package Shape

RECTANGULAR

Package Style

CHIP CARRIER

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

SMT

Connector pinout layout

1x9

Gross weight

0.5 g

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

TOSHIBA CORP

Package Description

CHIP CARRIER, R-XBCC-N3

Type of connector

pin strips

Operating temperature

-40...163°C

ECCN 代码

EAR99

端子位置

BOTTOM

终端形式

无铅

峰值回流焊温度（摄氏度）

未说明

Reach合规守则

unknown

Current rating

1.5A

时间@峰值回流温度-最大值(s)

未说明

引脚数量

3

JESD-30代码

R-XBCC-N3

资历状况

不合格

配置

SINGLE WITH BUILT-IN DIODE AND RESISTOR

操作模式

增强型MOSFET

箱体转运

DRAIN

晶体管应用

SWITCHING

极性/通道类型

N-CHANNEL

漏极-源极导通最大电阻

4 Ω

DS 击穿电压-最小值

20 V

场效应管技术

METAL-OXIDE SEMICONDUCTOR

最大耗散功率(Abs)

0.1 W

Rated voltage

60V

个人资料

beryllium copper

Plating thickness

0.254µm

Flammability rating

UL94V-0