Transcend Information TS16D42AR00LNS

ECCN (US)

4A994.a

HTS

8473.30.11.40

Module

DRAM模块

Module Density

16Gbyte

Chip Density (bit)

8G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

2400

Chip Configuration

1Gx8

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.14

Typical Operating Supply Voltage (V)

1.2

Maximum Operating Supply Voltage (V)

1.26

Operating Current (mA)

1088

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

ECC Support

无

Number of Ranks

Dual

SPD EEPROM Support

有

Supplier Package

UDIMM

Mounting

Socket

Package Height

31.25

Package Length

133.35

Package Width

3.9(Max)

PCB changed

288

包装

Bulk

零件状态

活跃

引脚数量

288

组织结构

2Gx64

模块类型

288UDIMM

RoHS状态

符合RoHS标准