Transcend Information TS256MSQ64V6U

ECCN (US)

EAR99

HTS

8473.30.11.40

Module

DRAM模块

Module Density

2Gbyte

Number of Chip per Module

16

Chip Density (bit)

1G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

667

Chip Configuration

128Mx8

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.8

Module Sides

Double

ECC Support

无

CAS Latency

5

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

SODIMM

Mounting

Socket

Package Height

30

Package Length

67.6

PCB changed

200

Lead Shape

No Lead

零件状态

LTB

引脚数量

200

组织结构

256Mx64

锁相环

无

自我刷新

无

模块类型

200SODIMM

RoHS状态

是,有豁免