Transcend Information TS2GKR72W6Z

ECCN (US)

EAR99

Module

DRAM模块

Module Density

16Gbyte

Number of Chip per Module

36

Chip Density (bit)

4G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

1600

Chip Configuration

1Gx4

ECC Support

有

Number of Ranks

Dual

CAS Latency

11

Standard Package Name

DIM

Supplier Package

RDIMM

Mounting

Socket

PCB changed

240

Lead Shape

No Lead

零件状态

Obsolete

引脚数量

240

组织结构

2Gx72

模块类型

240RDIMM

RoHS状态

符合RoHS标准