Transcend Information TS32MSD64V3F5

ECCN (US)

EAR99

Module

DRAM模块

Module Density

256Mbyte

Number of Chip per Module

8

Chip Density (bit)

256M

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

333

Chip Configuration

32Mx8

Chip Package Type

TSOP-II

Minimum Operating Supply Voltage (V)

2.3

Typical Operating Supply Voltage (V)

2.5

Maximum Operating Supply Voltage (V)

2.7

Module Sides

Double

ECC Support

无

CAS Latency

2.5

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

SODIMM

Mounting

Socket

Package Height

31.75

Package Length

67.6

PCB changed

200

Lead Shape

No Lead

零件状态

活跃

引脚数量

200

组织结构

32Mx64

锁相环

无

自我刷新

有

模块类型

200USODIMM

RoHS状态

符合RoHS标准