Transcend Information TS8D30AR00LNS

ECCN (US)

4A994.a

HTS

8473.30.11.40

Module

DRAM模块

Module Density

8Gbyte

Chip Density (bit)

4G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

1600

Chip Configuration

512Mx8

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.425

Typical Operating Supply Voltage (V)

1.5

Maximum Operating Supply Voltage (V)

1.575

Operating Current (mA)

1320

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

ECC Support

无

Number of Ranks

Dual

Supplier Package

UDIMM

Mounting

Socket

Package Height

30

Package Length

133.35

PCB changed

240

Maximum Clock Rate

1600(MHz)

Operating Temperature (Max.)

85C

Total Density

8GByte(b)

Operating Temperature Classification

Commercial

Package Type

UDIMM

Operating Temp Range

0C to 85C

Device Core Size

64(b)

Operating Supply Voltage (Max)

1.575(V)

Operating Supply Voltage (Typ)

1.5(V)

Rad Hardened

无

Operating Supply Voltage (Min)

1.425(V)

Operating Temperature (Min.)

0C

Main Category

DRAM模块

包装

Bulk

零件状态

活跃

引脚数量

240

组织结构

1Gx64

模块类型

240UDIMM

RoHS状态

符合RoHS标准