Transcend Information TS8D42AR00LNS

ECCN (US)

4A994.a

HTS

8473.30.11.40

Module

DRAM模块

Module Density

8Gbyte

Chip Density (bit)

8G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

2400

Chip Configuration

1Gx8

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.14

Typical Operating Supply Voltage (V)

1.2

Maximum Operating Supply Voltage (V)

1.26

Operating Current (mA)

1064

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

ECC Support

有

Number of Ranks

Single

Supplier Package

UDIMM

Mounting

Socket

Package Height

31.25

Package Length

133.35

Package Width

3.9(Max)

PCB changed

288

Maximum Clock Rate

2400(MHz)

Operating Temperature (Max.)

85C

Total Density

8GByte(b)

Operating Temperature Classification

Commercial

Package Type

UDIMM

Operating Temp Range

0C to 85C

Device Core Size

64(b)

Operating Supply Voltage (Max)

1.26(V)

Operating Supply Voltage (Typ)

1.2(V)

Rad Hardened

无

Operating Supply Voltage (Min)

1.14(V)

Operating Temperature (Min.)

0C

Main Category

DRAM模块

包装

Bulk

零件状态

活跃

引脚数量

288

组织结构

1Gx64

模块类型

288UDIMM

RoHS状态

符合RoHS标准