TT Electronics / BI Technologies BB1110TB7

包装/外壳

BGA

终端数量

27

ECCN (US)

EAR99

Resistance Value (Ohm)

50/25

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

125

Temperature Coefficient (ppm/°C)

±200

Circuit Designator

BUS

Case Style

Molded

Terminal Pitch (mm)

1

Package Type

BGA

Package Shape

Rectangular

Product Depth (mm)

3

Mounting

表面贴装

Operating Temp Range

-55C to 125C

No. of Terminals

27

Mounting Styles

表面贴装

Tolerance (+ or -)

1%

Rad Hardened

无

Seated Plane Height

Not Required(mm)

包装

卷带

容差

1%

零件状态

Obsolete

温度系数

±200(ppm/°C)

类型

Network

电阻

50/25(ohm)

额定功率

1(W)

端子间距

1(mm)

结构

Rectangular

军用标准

不需要

终端样式

Ball

失败率

不需要

电阻数

18

额定功率(W)

1

产品长度(mm)

9

产品高度(mm)

1.19

RoHS状态

RoHS non-compliant