Winbond W25Q32FWBYIG

表面安装

YES

终端数量

12

Package Description

WLCSP-12

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Number of Words Code

4000000

Package Body Material

PLASTIC/EPOXY

Risk Rank

5.62

Ihs Manufacturer

WINBOND ELECTRONICS CORP

Part Life Cycle Code

Obsolete

Manufacturer

Winbond Electronics Corp

Package Shape

RECTANGULAR

Package Code

VFBGA

Supply Voltage-Nom (Vsup)

1.8 V

Number of Words

4194304 words

Clock Frequency-Max (fCLK)

104 MHz

Manufacturer Part Number

W25Q32FWBYIG

Rohs Code

有

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.5 mm

JESD-30代码

R-PBGA-B12

电源电压-最大值(Vsup)

1.95 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

1.65 V

操作模式

SYNCHRONOUS

组织结构

4MX8

座位高度-最大

0.512 mm

内存宽度

8

记忆密度

33554432 bit

并行/串行

SERIAL

内存IC类型

FLASH

编程电压

1.8 V

宽度

2.03 mm

长度

2.31 mm

达到SVHC

compliant