WINBOND W25X40CVZPAG

表面安装

YES

终端数量

8

Package Description

HVSON,

Package Style

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Number of Words Code

512000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Operating Temperature-Max

105 °C

Rohs Code

有

Manufacturer Part Number

W25X40CVZPAG

Clock Frequency-Max (fCLK)

80 MHz

Number of Words

524288 words

Supply Voltage-Nom (Vsup)

3.3 V

Package Code

HVSON

Package Shape

RECTANGULAR

Manufacturer

Winbond Electronics Corp

Part Life Cycle Code

活跃

Ihs Manufacturer

WINBOND ELECTRONICS CORP

Risk Rank

5.73

Usage Level

Automotive grade

技术

CMOS

端子位置

DUAL

终端形式

无铅

功能数量

1

端子间距

1.27 mm

JESD-30代码

R-PDSO-N8

电源电压-最大值(Vsup)

3.6 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2.6 V

操作模式

SYNCHRONOUS

组织结构

512KX8

座位高度-最大

0.8 mm

内存宽度

8

记忆密度

4194304 bit

筛选水平

AEC-Q100

并行/串行

SERIAL

内存IC类型

FLASH

编程电压

3.3 V

宽度

5 mm

长度

6 mm

达到SVHC

compliant