Winbond W742C811

表面安装

YES

终端数量

100

Manufacturer Part Number

CBG-MLFPT8R

Manufacturer

ABB

Package Description

QFP, QFP100,.75X.99

Package Style

FLATPACK

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

QFP100,.75X.99

Supply Voltage-Nom

3 V

Operating Temperature-Max

70 °C

RAM(byte)

2560

Package Code

QFP

Package Shape

RECTANGULAR

ROM(word)

16384

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NUVOTON TECHNOLOGY CORP

Risk Rank

5.84

子类别

Microcontrollers

技术

CMOS

端子位置

QUAD

终端形式

鸥翼

端子间距

0.635 mm

Reach合规守则

compliant

JESD-30代码

R-PQFP-G100

资历状况

不合格

电源

3 V

温度等级

COMMERCIAL

速度

3.58 MHz

位元大小

4

只读存储器可编程性

MROM