Winbond W99688CBM3

表面安装

YES

终端数量

100

Ihs Manufacturer

WINBOND ELECTRONICS CORP

Manufacturer

Winbond Electronics Corp

Manufacturer Part Number

W99688CBM3

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Description

FBGA, BGA100,11X11,32

Package Equivalence Code

BGA100,11X11,32

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

Part Life Cycle Code

Obsolete

Risk Rank

5.84

子类别

其他消费类集成电路

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B100

资历状况

不合格

电源

2.5,3.3 V

温度等级

COMMERCIAL

消费者集成电路类型

消费电路