Winbond W99702G

表面安装

YES

终端数量

184

Manufacturer Part Number

DIBF50JCA35512DPY1BCBXXXHV

Manufacturer

Design Analysis

Package Description

FBGA, BGA184,18X18,20

Package Style

GRID ARRAY, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA184,18X18,20

Operating Temperature-Min

-20 °C

Operating Temperature-Max

85 °C

Rohs Code

有

Package Code

FBGA

Package Shape

SQUARE

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NUVOTON TECHNOLOGY CORP

Risk Rank

5.71

子类别

其他消费类集成电路

端子位置

BOTTOM

终端形式

BALL

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B184

资历状况

不合格

电源

1.2,3.3 V

温度等级

OTHER

消费者集成电路类型

消费电路