Winbond Electronics Corporation W25N01GWTCIG/TRAY

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

Automotive

无

PPAP

无

Cell Type

NAND

Chip Density (bit)

1G

Block Organization

Symmetrical

Address Bus Width (bit)

32

Number of Bits/Word (bit)

8

Number of Words

128M

Programmability

有

Timing Type

Synchronous

Max. Access Time (ns)

8

Maximum Erase Time (S)

0.01/Block

Maximum Programming Time (ms)

0.7/Page

Interface Type

Serial (SPI, Dual SPI, Quad SPI)

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.95

Programming Voltage (V)

1.7 to 1.95

Operating Current (mA)

35

Program Current (mA)

35

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

有

ECC Support

有

Support of Page Mode

无

Minimum Endurance (Cycles)

100000

Mounting

表面贴装

Package Height

0.85(Max)

Package Width

6

Package Length

8

PCB changed

24

Standard Package Name

BGA

Supplier Package

TFBGA

Lead Shape

Ball

包装

Tray

零件状态

活跃

引脚数量

24

建筑学

Sectored

行业规模

128Kbyte x 1024

页面尺寸

2Kbyte

引导模块

无