Winbond Electronics Corporation W25Q16DVSNSG

安装类型

表面贴装

包装/外壳

8-SOIC (0.154, 3.90mm Width)

供应商器件包装

8-SOIC

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8542.32.00.51

Automotive

Unknown

PPAP

Unknown

Cell Type

NOR

Chip Density (bit)

16M

Block Organization

Symmetrical

Address Bus Width (bit)

24

Number of Bits/Word (bit)

8

Number of Words

2M

Programmability

有

Timing Type

Synchronous

Max. Access Time (ns)

7

Maximum Erase Time (S)

10/Chip

Maximum Programming Time (ms)

3/Page

Interface Type

Serial (SPI, Dual SPI, Quad SPI)

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3|3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

25

Program Current (mA)

25

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

125

Command Compatible

有

ECC Support

无

Support of Page Mode

无

Minimum Endurance (Cycles)

100000

Mounting

表面贴装

Package Height

1.5(Max)

Package Width

4(Max)

Package Length

5(Max)

PCB changed

8

Supplier Package

SOIC N

Lead Shape

Gull-wing

Package

Tube

Base Product Number

W25Q16

厂商

Winbond Electronics

Product Status

Obsolete

Memory Types

Non-Volatile

操作温度

-40°C ~ 125°C (TA)

系列

SpiFlash®

零件状态

Obsolete

技术

FLASH - NOR

电压 - 供电

2.7V ~ 3.6V

引脚数量

8

内存大小

16Mbit

时钟频率

104 MHz

访问时间

6 ns

内存格式

FLASH

内存接口

SPI - Quad I/O

建筑学

Sectored

写入周期时间 - 字符、页面

50µs, 3ms

行业规模

4Kbyte x 512

页面尺寸

256byte

引导模块

无

组织的记忆

2M x 8