Winbond Electronics Corporation W25Q64FVSFIG/TRAY

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

Automotive

无

PPAP

无

Cell Type

NOR

Chip Density (bit)

64M

Block Organization

Symmetrical

Location of Boot Block

Bottom|Top

Address Bus Width (bit)

24

Number of Bits/Word (bit)

8

Number of Words

8M

Programmability

有

Timing Type

Synchronous

Max. Access Time (ns)

7

Maximum Erase Time (S)

100/Chip

Maximum Programming Time (ms)

3/Page

Interface Type

Serial (SPI, Dual SPI, Quad SPI)

Minimum Operating Supply Voltage (V)

2.7

Maximum Operating Frequency (MHz)

104

Typical Operating Supply Voltage (V)

3|3.3

Maximum Operating Supply Voltage (V)

3.6

Programming Voltage (V)

2.7 to 3.6

Operating Current (mA)

20

Program Current (mA)

25

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

有

ECC Support

无

Support of Page Mode

无

Minimum Endurance (Cycles)

100000

Mounting

表面贴装

Package Height

2.31

Package Width

7.49

Package Length

10.31

PCB changed

16

Standard Package Name

SOP

Supplier Package

SOIC W

Lead Shape

Gull-wing

包装

Tube

零件状态

Obsolete

引脚数量

16

建筑学

Sectored

行业规模

4Kbyte x 2048

页面尺寸

256byte

引导模块

有