Winbond Electronics Corporation W25R64FVSSIQ

Supplier Package

SOIC W

Lead Shape

Gull-wing

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

HTS

8542.32.00.71

Automotive

无

PPAP

无

Cell Type

NOR

Chip Density (bit)

64M

Block Organization

Symmetrical

Address Bus Width (bit)

24

Number of Bits/Word (bit)

8

Number of Words

8M

Programmability

有

Timing Type

Synchronous

Max. Access Time (ns)

8.5

Maximum Erase Time (S)

100/Chip

Maximum Programming Time (ms)

3/Page

Interface Type

Serial (SPI, Dual SPI, Quad SPI)

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3.3|3

Maximum Operating Supply Voltage (V)

3.6

Programming Voltage (V)

2.7 to 3.6

Operating Current (mA)

12

Program Current (mA)

25

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

有

ECC Support

无

Support of Page Mode

无

Mounting

表面贴装

Package Height

1.8

Package Width

5.28

Package Length

5.28

PCB changed

8

包装

Tube|Tray|Tape and Reel

零件状态

NRND

引脚数量

8

建筑学

Sectored

行业规模

4Kbyte x 2048

页面尺寸

256byte

引导模块

无