Winbond Electronics Corporation W29N01HVBINF/TRAY

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

Automotive

无

PPAP

无

Cell Type

SLC NAND

Chip Density (bit)

1G

Block Organization

Symmetrical

Address Bus Width (bit)

28

Number of Bits/Word (bit)

8

Number of Words

128M

Programmability

有

Timing Type

Asynchronous

Maximum Erase Time (S)

0.01/Block

Maximum Programming Time (ms)

0.7/Page

Interface Type

Parallel

Minimum Operating Supply Voltage (V)

2.7

Maximum Operating Frequency (MHz)

40

Typical Operating Supply Voltage (V)

3|3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

35

Program Current (mA)

35

Supplier Package

VFBGA

PCB changed

63

Package Length

11

Package Width

9

Package Height

0.6(Max)

Mounting

表面贴装

Minimum Endurance (Cycles)

100000

Support of Page Mode

有

ECC Support

有

Command Compatible

无

Supplier Temperature Grade

Industrial

Maximum Operating Temperature (°C)

85

Minimum Operating Temperature (°C)

-40

零件状态

活跃

引脚数量

63

建筑学

Sectored

行业规模

128Kbyte x 1024

页面尺寸

2Kbyte

引导模块

无