Winbond Electronics Corporation W29N01HZBINF/TRAY

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

Automotive

无

PPAP

无

Cell Type

SLC NAND

Chip Density (bit)

1G

Block Organization

Symmetrical

Address Bus Width (bit)

28

Supplier Package

VFBGA

PCB changed

63

Package Length

11

Package Width

9

Package Height

0.6(Max)

Mounting

表面贴装

Minimum Endurance (Cycles)

100000

Support of Page Mode

无

ECC Support

有

Command Compatible

无

Supplier Temperature Grade

Industrial

Maximum Operating Temperature (°C)

85

Minimum Operating Temperature (°C)

-40

Program Current (mA)

25

Operating Current (mA)

25

Maximum Operating Supply Voltage (V)

1.95

Typical Operating Supply Voltage (V)

1.8

Minimum Operating Supply Voltage (V)

1.7

Interface Type

Parallel

Maximum Programming Time (ms)

0.7/Page

Maximum Erase Time (S)

0.01/Block

Timing Type

Asynchronous

Programmability

有

Number of Words

128M

Number of Bits/Word (bit)

8

引脚数量

63

建筑学

Sectored

行业规模

128Kbyte x 1024

页面尺寸

2Kbyte

引导模块

无