Winbond Electronics Corporation W29N04GVSIAF TR

安装类型

表面贴装

包装/外壳

48-TFSOP (0.724, 18.40mm Width)

供应商器件包装

48-TSOP

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

HTS

8542.32.00.71

Automotive

有

PPAP

Unknown

Cell Type

SLC NAND

Chip Density (bit)

4G

Block Organization

Symmetrical

Address Bus Width (bit)

30

Number of Bits/Word (bit)

8

Number of Words

512M

Programmability

有

Timing Type

Asynchronous

Maximum Erase Time (S)

0.01/Block

Maximum Programming Time (ms)

0.7/Page

Interface Type

Parallel

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3|3.3

Maximum Operating Supply Voltage (V)

3.6

Programming Voltage (V)

2.7 to 3.6

Operating Current (mA)

35

Program Current (mA)

35

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

无

ECC Support

有

Support of Page Mode

无

Mounting

表面贴装

Package Height

1

Package Width

18.4

Package Length

12

PCB changed

48

Supplier Package

TSOP

Package

Tape & Reel (TR)

厂商

Winbond Electronics

Product Status

活跃

Memory Types

Non-Volatile

Supply Voltage-Nom (Vsup)

2.7V - 3.6V

操作温度

-40°C ~ 85°C (TA)

系列

-

零件状态

活跃

类型

SLC NAND Flash

技术

FLASH - NAND (SLC)

电压 - 供电

2.7V ~ 3.6V

引脚数量

48

内存大小

4Gbit

速度

40MHz

访问时间

25 ns

内存格式

FLASH

内存接口

ONFI

建筑学

Sectored

组织结构

High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set

写入周期时间 - 字符、页面

25ns, 700µs

记忆密度

4Gb

行业规模

128Kbyte x 4096

页面尺寸

2Kbyte

引导模块

无

温度

40ºC ~ 85ºC / -40ºC ~ 105ºC

组织的记忆

512M x 8