Winbond Electronics Corporation W74M32FVSSIQ

表面安装

YES

终端数量

8

EU RoHS

Compliant

ECCN (US)

3A991b.1.a.

HTS

8542.32.00.71

Automotive

无

PPAP

无

Chip Density (bit)

32M

Block Organization

Symmetrical

Number of Bits/Word (bit)

8

Number of Words

4M

Programmability

有

Timing Type

Synchronous

Max. Access Time (ns)

7

Interface Type

Serial (SPI, Dual SPI, Quad SPI)

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3|3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

30

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

有

ECC Support

无

Support of Page Mode

无

Minimum Endurance (Cycles)

100000

Mounting

表面贴装

Package Height

1.8

Package Width

5.28

Package Length

5.28

PCB changed

8

Standard Package Name

SOP

Supplier Package

SOIC

Lead Shape

Gull-wing

Package Description

SOIC-8

Package Style

小概要

Number of Words Code

4000000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

未说明

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

W74M32FVSSIQ

Clock Frequency-Max (fCLK)

80 MHz

Supply Voltage-Nom (Vsup)

3 V

Package Code

SOP

Package Shape

SQUARE

Manufacturer

Winbond Electronics Corp

Part Life Cycle Code

活跃

Samacsys Description

Security ICs / Authentication ICs Security Authentication spiFlash, 3V, 32M-bit

Ihs Manufacturer

WINBOND ELECTRONICS CORP

Risk Rank

2.36

包装

Tube

零件状态

活跃

类型

NOR型号

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

未说明

功能数量

1

端子间距

1.27 mm

Reach合规守则

compliant

引脚数量

8

JESD-30代码

S-PDSO-G8

电源电压-最大值(Vsup)

3.6 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2.7 V

操作模式

SYNCHRONOUS

建筑学

Sectored

组织结构

4MX8

座位高度-最大

2.16 mm

内存宽度

8

记忆密度

33554432 bit

并行/串行

SERIAL

内存IC类型

FLASH

编程电压

3 V

行业规模

4Kbyte x 1024

页面尺寸

256byte

引导模块

无

宽度

5.28 mm

长度

5.28 mm